Are they three college dropouts or a bunch of seasoned Silicon Valley execs in a trenchcoat?

Etched has come out of stealth stating: Earlier this year our A0 silicon came back from TSMC N4P, and today we are busy validating our first rack-scale product with customers to fulfill $1B in demand. We're a team of 400+ engineers from NVIDIA, Google TPUs, Broadcom, SK Hynix, TSMC, & more. We’ve raised $800M across four unannounced financings, including a strategic investment from VentureTech Alliance. We're excited to deepen our partnership with the world's leading semiconductor manufacturer. We’ve designed a new architecture to run our chip’s math blocks at under half the voltage of most AI chips. This enables multiple times the FLOPs density of AI chips today. We can run trillion parameter sparse MoEs at 80%+ Peak FLOPs without thermal throttling. We created a much lower-latency shared memory pool across our scale-up domain. We use a proprietary ultra-low-latency, high-bandwidth interconnect to enable dramatically faster memory access across chips. We'll see.

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Arm Slows Mobile CPU Introductions

Ugh. It's come to this: like, comment, and subscribe

BWR 17: Hot Chips 2026 Discussion

Hot Chips 2026: Next-Gen AI Accelerators, Memory Innovations, and Arm Surprises

Update: New story finally posted to XPU.pub

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IBM discloses Arm-compatible mainframe chip

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IBM Collaborates with Arm

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Fractile raising yet more money at an even higher valuation

Fractile raising yet more money at an even higher valuation