BWR 17: Hot Chips 2026 Discussion

Video cap of Joe and Bob talking with a jalapeno in the backgroundJoin Byrne-Wheeler Report hosts Joe and Bob as they discuss key disclosures from Hot Chips 2026, including Intel’s Diamond Rapids Xeon, AMD’s Helios MI450 platform, NVIDIA’s LPX/LPU architecture, Cerebras’s CS-4 wafer-scale engine, and OpenAI’s Jalapeño ASIC. If you work in AI hardware, semiconductors, GPUs, CPUs, interconnects, or data center architecture, this episode delivers insight unavailable […]

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TechInsights is on track for another year of double-digit growth

TechInsights is on track for another year of double-digit growth

Arm Slows Mobile CPU Introductions

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BWR 17: Hot Chips 2026 Discussion

Hot Chips 2026: Next-Gen AI Accelerators, Memory Innovations, and Arm Surprises

Update: New story finally posted to XPU.pub

Qualcomm closes the loop with Amazon

Qualcomm gains foothold at AWS

IBM discloses Arm-compatible mainframe chip

IBM discloses Arm-compatible mainframe chip

IBM Collaborates with Arm

IBM Collaborates with Arm