BWR 17: Hot Chips 2026 Discussion

Video cap of Joe and Bob talking with a jalapeno in the backgroundJoin Byrne-Wheeler Report hosts Joe and Bob as they discuss key disclosures from Hot Chips 2026, including Intel’s Diamond Rapids Xeon, AMD’s Helios MI450 platform, NVIDIA’s LPX/LPU architecture, Cerebras’s CS-4 wafer-scale engine, and OpenAI’s Jalapeño ASIC. If you work in AI hardware, semiconductors, GPUs, CPUs, interconnects, or data center architecture, this episode delivers insight unavailable […]

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Arm Slows Mobile CPU Introductions

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Hot Chips 2026: Next-Gen AI Accelerators, Memory Innovations, and Arm Surprises

BWR 17: Hot Chips 2026 Discussion

Update: New story finally posted to XPU.pub

Qualcomm closes the loop with Amazon

Qualcomm gains foothold at AWS

IBM discloses Arm-compatible mainframe chip

IBM discloses Arm-compatible mainframe chip

IBM Collaborates with Arm

IBM Collaborates with Arm

Fractile raising yet more money at an even higher valuation

Fractile raising yet more money at an even higher valuation